Ball Transfer Units

Maximum performance in the smallest space

Maximum performance in the smallest space

Maximum performance in the smallest space

Miniaturization is becoming more and more popular in more and more industries. The space required by components plays a crucial role, particularly in semiconductor manufacturing, where devices and machines are becoming increasingly compact and powerful. The Eschweiler drive specialist Rodriguez offers tailor-made miniature solutions for these requirements, such as particularly small ball transfer units that are used in die bonding machines.

"Thanks to their robustness and precision, our mini ball transfer units offer optimal conditions for use in the semiconductor industry and beyond," explains Jörg Schulden, Head of Linear Technology at Rodriguez. The ball transfer units, which weigh only between 3 and 11 grams, impress with their durable materials and a structure that was specially developed for demanding high-speed applications. These include silicon nitride balls and a durable aluminum outer ring. These mini ball transfer units are used in die bonding machines, among other things, because the chip bonding process requires consistently high precision and speed.

The machines ensure that electronic components are placed on base plates precisely and reliably - an essential process in the manufacture of telecommunications components. Rodriguez's mini ball transfer units are used in a special clamp that presses down the metal lead frame. This ensures precise and repeatable chip attachment, thus improving production quality and reducing failure rates.

In addition to the ball transfer units, Rodriguez's portfolio also includes other miniature components such as linear guides and ball screws, which are also ideal for the requirements of the semiconductor industry and other precision industries such as optics and medical technology. The mini linear guides, for example, enable precise positioning with minimal friction and are low-maintenance, which makes them ideal for use in highly sensitive areas such as 3D printing or measurement technology.

With its comprehensive range of miniature solutions - whether from the standard portfolio or as an individual custom-made product - Rodriguez is a reliable partner for semiconductor manufacturing and other precision industries. "Our customers expect miniature components that are tailored to their specific needs," says Jörg Schulden, "especially in die bonding, the repeatability and general reliability of the process are crucial for the quality of the end product. With our mini ball transfer units and miniature components, we can offer significant added value here."

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